Home » Adhesive Materials For Electronic Applications: Polymers, Bonding, And Reliability by Dale W. Swanson
Adhesive Materials For Electronic Applications: Polymers, Bonding, And Reliability Dale W. Swanson

Adhesive Materials For Electronic Applications: Polymers, Bonding, And Reliability

Dale W. Swanson

Published January 15th 2003
ISBN : 9780815514930
Hardcover
485 pages
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 About the Book 

The second title in the new interdisciplinary series for electronics engineers who work with polymers and materials engineers and polymer chemists who develop materials for electronics applications. Providing both theoretical foundations andMoreThe second title in the new interdisciplinary series for electronics engineers who work with polymers and materials engineers and polymer chemists who develop materials for electronics applications. Providing both theoretical foundations and practical data, coverage includes functions and requirements, chemistry and properties, bonding processes, reliability, and application specifications of adhesives and discusses epoxies, polyimides, silicones, polyurethanes, fillers, MCM, CSP, BGA, COB processes and more.